JPH0427182Y2 - - Google Patents
Info
- Publication number
- JPH0427182Y2 JPH0427182Y2 JP1986171576U JP17157686U JPH0427182Y2 JP H0427182 Y2 JPH0427182 Y2 JP H0427182Y2 JP 1986171576 U JP1986171576 U JP 1986171576U JP 17157686 U JP17157686 U JP 17157686U JP H0427182 Y2 JPH0427182 Y2 JP H0427182Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed circuit
- chip
- resist layer
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986171576U JPH0427182Y2 (en]) | 1986-11-07 | 1986-11-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986171576U JPH0427182Y2 (en]) | 1986-11-07 | 1986-11-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6377376U JPS6377376U (en]) | 1988-05-23 |
JPH0427182Y2 true JPH0427182Y2 (en]) | 1992-06-30 |
Family
ID=31107330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986171576U Expired JPH0427182Y2 (en]) | 1986-11-07 | 1986-11-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0427182Y2 (en]) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5617991U (en]) * | 1979-07-20 | 1981-02-17 | ||
JPS60110196A (ja) * | 1983-11-18 | 1985-06-15 | 松下電器産業株式会社 | スルホ−ル印刷配線板 |
JPS61188994A (ja) * | 1985-02-18 | 1986-08-22 | 富士ファコム制御株式会社 | プリント板のマ−キング方法 |
-
1986
- 1986-11-07 JP JP1986171576U patent/JPH0427182Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6377376U (en]) | 1988-05-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR940016639A (ko) | 접합제 인쇄 방법 | |
JPH0427182Y2 (en]) | ||
JPH08181166A (ja) | プリント配線板 | |
JP2002057441A (ja) | プリント配線板の穴埋め方法 | |
JPH08213747A (ja) | 表面実装部品の実装方法 | |
JPS63268286A (ja) | 面実装部品 | |
JP3392337B2 (ja) | はんだ印刷用マスクおよびその製造方法 | |
JPS6197893A (ja) | 半田印刷用マスク | |
JP2500232Y2 (ja) | 混成集積回路装置 | |
JPH06349969A (ja) | 印刷基板および半導体実装基板 | |
JPS6138944U (ja) | 半導体装置 | |
KR0175423B1 (ko) | 플립 칩 랜드 인쇄 마스크 | |
JPH0116039B2 (en]) | ||
JP3051132B2 (ja) | 電子部品の実装方法 | |
JPS635817Y2 (en]) | ||
JPH0276290A (ja) | チップ部品の実装方法 | |
JPH0555736A (ja) | チツプ部品実装法 | |
JPS5897893A (ja) | プリント板へのチツプ部品の実装方法 | |
JP2000091724A (ja) | プリント基板 | |
JPH10322002A (ja) | プリント基板 | |
JPS58166070U (ja) | プリント配線板 | |
JPS63144596A (ja) | 厚膜形成方法 | |
JPS5929065U (ja) | プリント基板 | |
JPH01245588A (ja) | 配線基板 | |
JPS6367360B2 (en]) |